Program Overview

Discover China’s innovation hub through this exclusive, fully funded opportunity at Tsinghua SIGS. Designed for global talents. It offers academic immersion with world-class faculty and authentic cultural experiences in dynamic Shenzhen and aims to facilitate cross-cultural exchange. With straightforward requirements and limited availability, this is your gateway to China’s academic excellence. Applications are now open for this transformative summer experience.

Program Details

  • Host Country: China
  • Host University: Tsinghua Shenzhen Graduate School (SIGS)
  • Location: Shenzhen
  • Participants: Open to all (non-Chinese citizen)
  • Program Duration: 1 week
  • Dates for the Program: June 22 – June 28, 2025
  • Scholarship Level: Fully Funded
  • Deadline to Apply: March 20, 2025

Program Highlights

  • Academic Excellence:

      • Learn with professors from Tsinghua University
      • Stay up to date with lectures on tech, sustainability, entrepreneurship, and global trends.
  • Collaborative Learning:

      • To solve issues, make a team. 
      • Engage in workshops and groups with peers from around the world.
  • Industry Exposure:

      • Explore top technology companies and research laboratories in Shenzhen (like Huawei, Tencent, or DJI).
      • Take a tour of SIGS’s cutting-edge facilities.
  • Cultural Immersion:

    • Take part in a tea ceremony and taste local cuisine to experience Chinese culture.
    • Guided tours of Shenzhen landmarks, including Dafen Oil Painting Village or OCT Loft.

Scholarship Benefits

The fully funded scholarship includes:

  • Full waiver of program fees (worth over $1,500).
  • Free accommodation (shared dormitory or hotel).
  • Daily meals (breakfast, lunch, and dinner).
  • Coverage of all field trips and cultural activities.
  • Networking opportunities with Tsinghua alumni and industry leaders.

Eligibility Criteria

It is open to all non-Chinese passport holders. No age restrictions apply. Current students and recent graduates are eligible. All academic backgrounds accepted. Basic English is required, and no test is needed. Submit just a passport copy and transcripts. No application fee or minimum GPA. First-time China visitors encouraged. No recommendation letters or interviews required. Disability accommodations available. Early applications receive priority. We value passion over perfect grades. Limited spaces available – apply now.

Required Documents

  1. Passport Copy
  2. Academic Transcripts (latest official records).
  3. Personal Statement (Optional but Recommended): Explain your motivation for joining (max 500 words).
  4. Proof of English Proficiency (Optional): If available (e.g., TOEFL, Duolingo, or university medium-of-instruction letter).

How to Apply

    1. Visit the Official Website:

  • Complete the Online Form:

      • Fill in personal, academic, and contact details.
  • Upload Documents:

      • Submit scanned copies of required files (PDF format preferred).
  • Submit Before Deadline:

    • Applications close on March 20, 2025 (no late submissions accepted).

Why Choose Tsinghua SIGS Summer School?

World-famous university name. China’s top-ranked institution. Short but powerful program. Learn from superstar professors. See futuristic tech labs. Visit famous companies. Meet students from 50+ countries. All costs fully covered. Free, nice accommodation. Delicious Chinese meals included. Fun cultural activities daily. Great for your resume. Make lifelong friends. Experience real China. Safe and organized. Perfect first China trip. Small group attention. Hands-on learning style. No boring lectures. Just one amazing week. Changes how you see the world.

Tips for a Strong Application

  • Early Submission: Avoid last-minute technical issues.
  • Clear Personal Statement: Highlight your academic interests and cultural curiosity.
  • Verify Documents: Ensure your documents are eligible.

Contact Information

For queries, email: summerschool@sigs.tsinghua.edu.cn

Don’t Miss This Opportunity!

Apply Now: Official Application Link
Deadline: March 20, 2025

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